IEEE/ACM International Symposium on Quality of Service
15-17 June 2020 // Hangzhou, China

Committees

Organizing Committee

General Co-chairs

Kui Ren, Zhejiang University, China

Jinsong Han, Zhejiang University, China

TPC Co-chairs

Dan Wang, The Hong Kong Polytechnic University, Hong Kong

Xue Liu, McGill University, Canada

Tommaso Melodia, Northeastern University, USA

Finance Chair

Meng Shen, Beijing Institute of Technology, China

Local Chair

Jinsong Han, Zhejiang University, China

Publication Chair

Di Wu, Samsung AI Center – Montreal, Canada

Publicity Co-chairs

David A. Mohaisen, University of Central Florida, USA

Xi Chen, Samsung AI Center – Montreal, Canada

Web Chair

Jia Liu, Nanjing University, China

Technical Program Committee

Wei Bao, Sydney, Australia

Kaigui Bian, Peking University, China

Robert Birke, ABB Future Labs, USA

Torsten Braun, University of Bern, Switzerland

Nan Cen, Missouri University of Science and Technology, USA

Xi Chen, Samsung AI Center – Montreal, Canada

Yang Chen, Fudan University, China

Yanjiao Chen, Wuhan University, China

Haipeng Dai, Nanjing University, China

Wei Dong, Zhejiang University,  China

Chenfei Gao, AT&T Labs – Research, USA

Yi Gao, Zhejiang University, China

Zhangyu Guan, University at Buffalo, USA

Mohammad Hassan Hajiesmaili, Johns Hopkins University, USA

Chuang Hu, The Hong Kong Polytechnic University, Hong Kong

Yang Hu, The University of Texas at Dallas, USA

Jinho Hwang, IBM Research, USA

Lei Jiao, University of Oregon, USA

Song Min Kim, KAIST, Korea

Fanxin Kong, Syracus, USA

Linghe Kong, Shanghai Jiao Tong University, China

Patrick P. C. Lee, CUHK, Hong Kong

Baochun Li, University of Toronto, Canada

Qing Li, Southern University of Science and Technology, China

Ruidong Li, NICT, Japan

Fangming Liu, Huazhong University of Science and Technology, China

Jia Liu, Nanjing University,  China

Di Niu, University of Alberta, Canada

Dan Pei, Tsinghua University, China

Miao Pan, University of Houston, USA

Kaliappa Ravindran, City University of New York, USA

Danda Rawat, Howard University, USA

Shaolei Ren, University of California, Riverside, USA

Francesco Restuccia, Northeastern University, USA

Abusayeed Saifullah, Wayne State University, USA

Meng Shen, Beijing Institute of Technology, China

Ryoichi Shinkuma, Kyoto University, Japan

Simone Silvestri, University of Kentucky, USA

Qingyun Sun, Stanford University, USA

Cong Wang, City University of Hong Kong, Hong Kong

Haiyang Wang, University of Minnesota at Duluth, USA

Ju Wang, University of Waterloo, Canada

Wei Wang, HKUST, Hong Kong

Weichao Wang, University of North Carolina at Charlotte, USA

Xin Wang, Fudan University, China

Xinbing Wang, Shanghai Jiao Tong University, China

Yi Wang, Southern University of Science and Technology, China

Chuan Wu, The University of Hong Kong, Hong Kong

Di Wu, Samsung AI Center – Montreal, Canada

Fan Wu, Shanghai Jiao Tong University, China

Kui Wu, University of Victoria, Canada

Qiao Xiang, Yale University, USA

Meng Xu, Apple, USA

Jie Yang, Florida State University, USA

Jianguo Yao, Shanghai Jiao Tong University, China

David Yau, Advanced Digital Sciences Center, Singapore

Fan Ye, Stony Brook University, USA

Beichuan Zhang, University of Arizona, USA

Hongwei Zhang, Iowa State University, USA

Lan Zhang, USTC, China

Rui Zhang, University of Delaware, USA

Weiyi Zhang, AT&T Research, USA

Jiaqi Zheng, Nanjing University, China

Yanmin Zhu, Shanghai Jiao Tong University, China

Steering Committee

Ke Xu (Chair), Tsinghua University, China

Jiangchuan Liu (Past Chair), Simon Fraser University, Canada

Xiaorui Wang, The Ohio State University, China

Admela Jukan, Technische Universitä Braunschweig, Germany

Jianping Wang, City University of Hong Kong, Hong Kong

Zongpeng Li, University of Calgary, Canada

Chuan Wu, University of Hong Kong, Hong Kong